According to the International Energy Agency (IEA) forecast, the global fleet of pure electric vehicles (EVs) and hybrid electric vehicles (HEVs) on roads will reach 250 million by 2030. In 2018, IEA reported only 5.1 million such vehicles worldwide. This represents a dramatic increase, driven by mutually reinforcing technological advances in powertrains, power electronics, battery cells/packs, and charging infrastructure.
According to the International Energy Agency (IEA) forecast, the global fleet of pure electric vehicles (EVs) and hybrid electric vehicles (HEVs) on roads will reach 250 million by 2030. In 2018, IEA reported···
The semiconductor production process encompasses four key stages: wafer fabrication, wafer testing, chip packaging, and post-packaging testing – with testing requirements spanning the entire workflow. Particularly for high-end and complex chips, testing becomes increasingly critical. Zero deviations are permitted at any process step, as testing comprehensiveness directly determines the quality of final electronic products. With the emergence of 5G, big data, AI, and other new markets, growing semiconductor complexity drives demand for higher-performance testing. In this context, global semiconductor test equipment providers are innovating testing systems to meet evolving requirements.
GreenTest Technologies supports national semiconductor industry strategic initiatives by collaborating with premier measurement instrument manufacturers including Keysight, Tektronix, NI, and Iwatsu. We are committed to delivering standardized, compliant, and automated semiconductor testing solutions.
Background: Automotive electrification continues to increase year by year, with all indications pointing toward accelerated future growth. Key drivers include the growing adoption of hybrid and pure electric vehicles to meet "green energy" targets, industry-wide expectations for higher reliability in electronic components, the need to reduce vehicle recalls (historically caused more by mechanical failures than electrical failures), and intensifying global competition in the automotive and auto parts industries where manufacturers face pressure to develop features at lower costs without compromising energy efficiency, safety, and reliability.
Background: The emergence of the Internet of Things (IoT) has not only significantly increased the diversity and volume of IoT microcontroller semiconductor devices but has also created demand for testing these devices at lower costs—a requirement that traditional ATE solutions fundamentally cannot meet.
Advantages: The STS provides a flexible production test platform that can scale to meet expanding production volume requirements while also simplifying to accommodate limited budgets. It addresses the testing needs of microcontroller-based IoT semiconductor devices, supporting communication standards including Bluetooth LE, NB-IoT, WiFi, and ZigBee.
Semiconductor burn-in testing refers to a method where semiconductor devices are continuously subjected to environmental stress at specific ambient temperatures over extended periods to accelerate the manifestation of inherent failures.
In semiconductors, failures are generally categorized into infant mortality failures, random failures, and wear-out failures.
1. Infant mortality failures occur during the initial operational phase of devices. The failure rate decreases over time
2. Random failures occur over longer periods with a constant observed failure rate
3. Wear-out failures appear as devices approach end-of-life, with failures increasing significantly as the device lifespan depletes
